Film thickness measuring instrument
OXFORD
CMI 760(MRX): High sensitivity copper thickness tester
Oxford Instruments CMI700MRX series copper film thickness tester is designed to meet the needs of copper thickness measurement and quality control in the printed circuit board industry.
CMI760 can be used to measure the same thickness of surface copper and through holes.
This highly expandable desktop thickness gauge system uses two methods, micro resistance and eddy current, to accurately and accurately measure the copper thickness on the surface and in the through hole.
A. SRP-4
Main application: measurement of copper thickness
Test principle: adopt Micro-resistance mode
Test range: chemical copper 10μin-500μin (0.25μm-12.7μm)
Electroplating copper 0.1mil-12mil (2.5μm-300μm)
Measurement limit: minimum test width 0.8mm (0.031inch) x length 25mm (1inch)
Probe material: copper alloy
Resolution: 0.01mils≧1mil, 0.001mils＜1mil, 0.1um≧10um
0.01um＜10um, 0.001um＜1um
Accuracy: ±3% reference comparison film
B.ETP
Main purpose: measurement of copper thickness (one copper, two copper before etching and copper after etching)
Test principle: adopt Eddy-current mode
Comply with relevant regulations of ASTM-E376-96 standard
Test range: 0.08~4.0mil
Minimum aperture: 35mil
Resolution: 0.01mils(0.25um)
Accuracy: ±3% reference comparison film
TRP-1A/S (standard) probe:
Main purpose: measurement of copper thickness of holes (after etching)
Test principle: adopt Micro-resistance mode
Test range: 0.08~4.5mil
Measurement limits: upper and lower limits of aperture 20~185mil (0.5~4.6mm)
Board thickness limit: the minimum board thickness should be greater than the aperture 3mil, the maximum board thickness is 175mil
TRP-1A/M (micro) probe
Main purpose: measurement of copper thickness of holes (after etching)
Test principle: adopt Micro-resistance mode
Test range: 0.5~2.5mil
Measurement limits: upper and lower limits of aperture 10~40mil (0.25~1mm)
Board thickness limit: the minimum board thickness should be greater than the aperture 3mil, the maximum board thickness is 175mil
CMI563: Handheld surface copper thickness tester
Oxford Instruments CMI563 series surface copper thickness gauges are dedicated to measuring rigid and flexible, single-layer and double-layer or multilayer printed circuit boards.
Principle of micro resistance test:
The micro-resistance test technology uses four contact probes to generate electrical signals on the surface of the copper foil for measurement.
The SRP-4 probe uses four uniquely designed, tough and durable probes (patented by Oxford Instruments) to ensure high accuracy, small contact area and minimum measurement surface area.
The probe can be seen through the transparent shell, enabling customers to accurately locate the test location.
The probe uses a high-durability alloy to resist breakage and wear.
When the probe touches the copper foil sample, a constant current flows through the two outer probes, and the inner two probes measure the change in electrical voltage. According to Ohm's law, the voltage value is converted to the resistance value, and the thickness value is calculated using a certain function. The micro-resistance testing technology provides high-accuracy copper thickness measurement for copper foil applications.
Specifications:
Accuracy: ±3% (±0.3um) reference comparison film
Accuracy: chemical copper: standard deviation 0.2%
Copper plating: standard deviation 0.5%
Resolution: 0.01mils≧1mil
0.001mils＜1 mil,0.1um≧10um
0.01um＜10um,0.001um＜1um
Measuring thickness range:
Chemical copper: 10uin-500uin
Copper electroplating: 0.1mil-6mil
Linear copper wire width: 8mil-250mil
Stored data: 13,500 records
Size: 5X3X1 (inch)
Weight: 260 grams (including electromagnetic)
Unit: mil, um
Battery: 9 volt battery
Connection port: RS-232, transmitted to printer or computer
Display: 4-digit LCD liquid crystal display
Statistics display: measurement number, standard deviation, average, maximum, minimum
Computer download: directly transfer data to the computer with a button
